OSAP国际先进封装技术实验室 OSAP International Advanced Packaging Lab

先进封装工艺全套解决方案提供商 Complete Advanced Packaging Process Solutions Provider

专注于2.5D/3D封装、玻璃基板封装、混合键合等先进封装技术研发与产业化，为全球半导体行业提供材料、设备、人员和工艺的完整解决方案。 Focusing on advanced packaging technologies including 2.5D/3D packaging, glass substrate packaging, and hybrid bonding R&D and industrialization, providing complete solutions for materials, equipment, personnel and processes to the global semiconductor industry.

20+ 年行业经验 Years Experience
30+ 服务企业 Client Companies
100+ 专业人才 Professionals
探索解决方案 Explore Solutions 咨询合作 Contact Us
🔬

核心技术能力 Core Technical Capabilities

打造"1+2+2+3"技术能力群，引领先进封装技术发展 Building "1+2+2+3" technology capability cluster, leading advanced packaging technology development

⚡

2.5D/3D封装技术 2.5D/3D Packaging

TSV技术、硅中介层、uBump、高精度键合等核心工艺，对标台积电CoWoS技术水平 TSV technology, silicon interposer, uBump, hybrid bonding and other core processes, benchmarking TSMC CoWoS technology

🔬

玻璃基板封装 Glass Substrate Packaging

TGV技术、FOPLP工艺开发，突破玻璃基板封装核心技术瓶颈 TGV technology and FOPLP process development, breaking through core technology bottlenecks in glass substrate packaging

🤖

智能制造系统 Intelligent Manufacturing

AI驱动的智能控制系统，实现工艺优化、良率提升和成本降低 AI-driven intelligent control systems for process optimization, yield improvement and cost reduction

⚙️

先进设备研发 Advanced Equipment R&D

自主研发先进封装关键设备，打造完整的装备产业链 Independent R&D of key advanced packaging equipment, building a complete equipment industrial chain

🧪

新材料研究 New Materials Research

导热材料、陶瓷粉体、高分子材料等先进封装材料研发 R&D of advanced packaging materials including thermal conductive materials, ceramic powders, and polymer materials

💡

IP授权服务 IP Licensing Services

自研先进封装工艺IP库，提供技术授权和解决方案服务 Self-developed advanced packaging process IP library, providing technology licensing and solution services

全套解决方案 Complete Solutions

从联合研发到代工设计，再到IP授权的完整产业化服务 Complete industrialization services from joint R&D to foundry design and IP licensing

🔗

联合研发服务 Joint R&D Services

  • 关键技术共同研发 Joint development of key technologies
  • 核心工艺联合攻关 Joint breakthrough in core processes
  • 新设备新材料研发 New equipment and materials R&D
  • 小批量试制服务 Small-batch pilot production services
  • 专利授权合作 Patent licensing cooperation
🎯

代工设计服务 Foundry Design Services

  • 先进封装工艺设计 Advanced packaging process design
  • 芯片封装协同设计 Chip-package co-design
  • 系统级封装解决方案 System-in-package solutions
  • 电气与热仿真 Electrical and thermal simulation
  • DFT封装测试方案 DFT packaging test solutions
📋

工艺IP授权 Process IP Licensing

  • 先进封装工艺IP库 Advanced packaging process IP library
  • 产品IP解决方案 Product IP solutions
  • 技术专利授权 Technology patent licensing
  • 工艺标准制定 Process standard development
  • 技术培训服务 Technical training services
🏭

中试线服务 Pilot Line Services

  • 12寸先进封装中试线 12-inch advanced packaging pilot line
  • 2.5D/3D工艺验证 2.5D/3D process verification
  • 玻璃基板工艺开发 Glass substrate process development
  • 量产工艺优化 Mass production process optimization
  • 设备工艺匹配 Equipment-process matching

科研成果展示 Research Achievements

突破性技术创新，引领行业标准制定 Breakthrough technological innovations leading industry standard development

01

2.5D/3D封装技术突破 2.5D/3D Packaging Breakthrough

成功开发10μm线宽TSV工艺，实现超高密度互连，性能达到国际先进水平 Successfully developed 10μm line width TSV process, achieving ultra-high density interconnection with international advanced performance

10μm TSV线宽 TSV Line Width
99.8% 良率 Yield Rate
02

玻璃基板封装创新 Glass Substrate Innovation

突破玻璃基板TGV工艺难题，实现大尺寸玻璃基板高精度加工，填补国内空白 Breakthrough in glass substrate TGV process, achieving high-precision processing of large glass substrates, filling domestic gaps

300mm 基板尺寸 Substrate Size
5μm 加工精度 Processing Precision
03

高精度键合技术 High-Precision Bonding Technology

键合精度正负50纳米，实现晶圆级超高精度对准，键合强度超越行业标准 Bonding precision of ±50 nanometers, achieving wafer-level ultra-high precision alignment with bonding strength exceeding industry standards

±50nm 对准精度 Alignment Precision
<10μm 互联间距 Interconnect Spacing

全球合作伙伴 Global Partners

与世界顶级企业深度合作，共同推进先进封装技术发展 Deep cooperation with world-class enterprises to jointly advance advanced packaging technology

低轨卫星天线优化 LEO Satellite Antenna Optimization

通过玻璃基板先进封装技术，优化相控阵收发射天线，已交付500+套产品 Optimizing phased array antennas through glass substrate advanced packaging technology, delivered 500+ products

人形机器人关节模组 Humanoid Robot Joint Modules

利用玻璃基板技术重新设计Optimus关节模组，优化尺寸和能耗表现 Redesigning Optimus joint modules with glass substrate technology to optimize size and energy consumption

AI芯片封装方案 AI Chip Packaging Solutions

基于玻璃基板封装技术提升AI芯片性能，创造差异化竞争优势 Enhancing AI chip performance with glass substrate packaging technology to create differentiated competitive advantages